Feature of Sn96.5Ag3.0Cu0.5 solder paste:

1.Halogen-free per IPC definition.
   Capable of 01005 print and reflow, even in air reflow environment.

2.Can print down to 8 mil x 8 mil apertures.

3.Designed specifically for fine feature printing with T4 powder

4.Low QFN/BGA voiding.

5.Excellent solderability with halogen-free chemistry.

6.Optimized flux residues to mitigate head-in-pillow defects Capable of print speeds up to 6 in/sec (150mm/sec).

7.Low slump behavior minimizes defects.
Other kinds of solder paste

Description:Sn96.5Ag3.0Cu0.5 solder paste

BBIEN'S SAC305 silver solder paste is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies.
This paste was formulated to replace traditional rosin/resin based no-clean formulations with more reliable synthetic materials. The residue is pin probable for ICT inspection.

 Although BBIEN SAC305 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents.
Temperature chart

Testing datasheet for SAC305 paste

Item	Specification	Standard
Appearance	Gray paste w/o visible foreign matter and clusters
Alloy composition	Sn/Ag3.0/Cu0.5/x	JIS-Z-3282
Melting Point	217-219 °C
Particle Size	(Type 3) +45μm < 1%, —20μm < 10% (Type 4) +38μm < 1%, —20μm < 10% (Type 5) +25μm < 1%, —15μm < 10% (Type 6) +15μm < 1%, —5μm < 10%	IPC-TM-650,2.2.14
Powder Shape	Spherical
Flux Content	11 ± 1.0wt%	JIS-Z-3197, 8.1.2
Viscosity	200 ± 30 Pa s (25±1 C°, 10rpm,Malcom )	JIS-Z-3284, Annex 6
Flux Type	ROL1	J-STD-004B

--Test Content--

Test Item	Test Result	Test Method
Copper Plate Corrosion Test	Pass	JIS-Z-3197, 8.4.1
Spread Test	> 75%	JIS-Z-3197, 8.3.1.1
Copper Mirror Test	Pass	IPC-TM-650, 2.3.32
Viscosity Test(25 °C,10rpm)	200 ± 30 Pa • s	JIS-Z-3284. Annex 6
Tackiness Test (gf)	> 130 (8hr)	JIS-Z-3284. Annex 9
Slump Test	Pass	JIS-Z-3284. Annex 7, 8
Solder Ball Test	Pass	JIS-Z-3284. Annex 11

--Reliability Test--

S.I.R. Test ◊	> 1×109 Ω , Pass	IPC-TM-650, 2.6.3.3
Electro Migration Test ♦	Pass	IPC-TM-650, 2.6.14.1

◊ Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs
--Alloy Composition--

(Sn)

(Ag)

(Cu)

(Ni)

(Ge)

(Zn)

(Al)

(Sb)

(Fe)

(As)

(Bi)

(Cd)

(Pb)

REM.

2.8~3.2

0.3~0.7

0~0.01

0~0.01

0.001 MAX

0.001 MAX

0.05 MAX

0.02 MAX

0.03 MAX

0.10 MAX

0.002 MAX

0.05 MAX

90% Metal – Stencil Printing
90% Metal – Enclosed Head Printing
kinds of electronica components,e.g.SMT,calculators,computer boards,PCB etc
Flow Chart for Quality Guarantee  

 

Material Inspection ( a. Our QA Department   b. National Certification Department  Note: Major material )  →Flux character Inspection→ Process products → Solder Paste Inspection → Solder Paste Package Inspection  → Finished Products Inspection → Shipment Choice Inspection

Storage situation
Sn96.5Ag3.0Cu0.5 no clean solder paste does not require refrigeration if left at room temperature 23degree for 6 months and has a 8-12-month refrigerated (2-9degree) shelf life.

BBIEN'S SAC305 is a no-clean formula. The residues do not need to be removed for typical.
 Sn/Ag3.0/Cu0.5/x alloy with Type 3 particle size (+45 µm 1% less, -20 µm 10% less) and no-clean ROL1 flux. It comes packaged in a 500-gram jar.
·         Pb < 1000 ppm, Cd < 20 ppm
·         High print speed: 0-120 mm/sec
·         Over 8 hours stencil life
·         Extended tack time > 12 hours
·         Excellent wettability
·         Low void
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for SAC305 lead free solder pasteto maintain consistent viscosity,reflow characteristics and overall performance.SAC305 lead free solder pasteshould be stabilized at room temperature prior to printing. SAC305 lead free solder pasteshould be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6-10 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).
 
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.