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200ml Red resin SMT adhesive used for wav soldering technique
resin adhesive
200ml Red resin SMT adhesive used for wav soldering technique
Specification of Red resin SMT wlding adhesive
    Composition  SMT Epoxy resin
     Appearance   Paste/red-colored
  Specific gravity 1.25
 Viscosity at 25°C,5rpm 350Pa·S
 Thixotropy index 6.8(1rpm/10rpm)
Adhesive Strength  2125C
Mini-mold tr
SOP·IC 16P                              
44N(4.5kgf)0.2mgr twin
45N(4.6kgf)0.3mgr twin
92N(9.4kgf)0.8mgf single×2
     Electric Property
 Volume resistance
    Insulation resistance
    Initial value
    After treating*
   Dielectric constant
   Dielectric loss tangent
 
3.6×1016Ω·cm    JIS K6911
 
1.2×1014Ω                JIS Z3197
1.2×1012Ω               
3.12/1MHZ      JIS K6911
0.012/1MHZ     JIS K6911
   Preservation condition 10°C
To be strictly kept at less than
10°C in refrigerator
 
Epibond Surface Mount Adhesives in clude Dispensing and  Frictioning /stencil using two kinds of techniques.
We make 30ml 200ml and 300ml per syringe packing.

SHENZHEN BBIEN TECHNOLOGY LIMITED

RED GLUE ADHESIVE HAVE THE FOLLOWING FEATURE:
  1. Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very small dots. 

  2. Stable adhesive strength can be obtained with a variety of SMD. 
  3.  Long-term preservation stability is expected. 
  4.  High heat-resistivity and excellent electric properties are possessed.
  5.  Usable for screen printing.
  6. 1)      Much lower temperature curing is aimed at amd is practically possible.
    2)      Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots.
    3)    stable adhesive strength can be obtained with a variety of SMD.
    4)   Long-term preservation stability is expected.
    5)      High heat-resistivity and excellent electric properties are possessed.


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